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殘留應力的模擬方法
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Moldex3D
Stress
實際狀況:
*射出品回火之後可改善噴漆開裂或吸漆不良, 初判為降低殘留應力所致
那請問:
1.噴漆相關的殘留應力如何模擬?
2.可透過不同模溫來模擬回火之後的殘留應力?
瑛倡
Posted on 8 8 月, 2024 in
Moldex3D.
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HOT QUESTIONS
Material to use for PCB boards?
iSLM Personal Mode 升級安裝後,沒有出現 Launch Project 啟動 Studio 專案的按鈕
API: Get the current result type
Setup Error
IM sensors
Hope ModiBot can answer questions regarding comptuer spec for analysis
iSLM 有些專案一直呈現轉圈狀態,無法檢視也無法刪除
关于排气分析
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