Flow Pack solver considers mainly flow related heating effects eg. shear heating, viscous heating effects, whereas Cool solver considers mainly moldbase temperature effects eg. heat transfer from moldbase. Because of the differences, we provide these two different analysis sequences.

Process simulation is  fully coupled where temperature data is exchanged synchronously between each solver (F/P/Ct/W). It can provide more accurate temperature results for flow field with larger mold temperature difference, however, will take longer time for calculation.

Transient analysis relies on intermediate files for data exchange. For flow fields with small changes in mold temperature, it would still achieve excellent convergence results with shorter calculation time.